How to Improve Hot Melt Adhesive Efficiency
Improved efficiency is an overriding concern in today’s competitive environment. An easy place to start is with adhesive usage. Most automatic hot melt applications can be adjusted to operate with less hot melt adhesive. When planned and executed properly, adhesive reduction can offer significant long term cost savings.
Before making any changes to your hot melt system or adhesives, you should produce sample blanks with non-compressed hot melt and glued samples for evaluation by your hot melt adhesive and hot melt machinery suppliers.
To make thorough recommendations for your adhesive process, it is important to include some information with your samples, including hot melt system temperatures, air pressure used for the pump, nozzle tip orifice size, adhesive specification sheet, current consumption per package, type of hot melt system currently in use, speed of operation, and frequency of hot melt maintenance.
It can also be helpful to have your engineering, maintenance, and production personnel review these same samples. They are often able to provide valuable insight into your adhesive application and consumption process.
Too often, Hot Melt Adhesive is used to compensate for other deficiencies in the production process. Dirty and/or poorly maintained hot melt systems can result in reduced adhesive bond quality. Nozzle clog issues can merely be the result of an incorrect orifice size on the nozzles. Another point to consider with regard to potential adhesive waste is hot melt application temperature. If the temperature is too hot, and the adhesive is too thin, this can result in excess amounts of adhesive being dispensed.
The case, carton, corrugated box sealing and erecting industry is one that has seen significant improvements on adhesive savings with the use of professional and in-house adhesive consumption consultation. It is important to note that incorrect compression of the adhesive and substrate on the erector or sealer can affect the sealing capacity of hot melts between substrates.
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