We have already introduced the use of hot melt adhesiv […]
We have already introduced the use of hot melt adhesive film, which involves three process elements of temperature, pressure and time. As the application of hot melt adhesive film becomes more and more extensive, more and more new materials are beginning to try to use hot melt adhesive film to bond. At the same time, they will also encounter many problems, because different materials have their own characteristics. Different, if you don't understand the nature of the film itself, you will often encounter some unsuitable situations.
When customers use hot melt adhesive film, there is a situation that the material itself is deformed when the hot melt adhesive film is not melted during hot pressing.
This is because every material has a temperature range that it can withstand, some materials can withstand high temperatures, and some materials can withstand low temperatures. When the temperature resistance of our material itself is not high, it is easy to be deformed by heat. And when we choose hot melt adhesive film to bond this material, we must consider this temperature condition. If the melting temperature of the selected hot-melt adhesive film is similar to the temperature resistance temperature of the material to be adhered, even if the hot-melt adhesive film melts, the material will become soft. Compression deformation, so not to say that it is bonding, the material is directly scrapped.
So, how can we solve this problem? In fact, we only need to deliberately choose a low-temperature hot melt adhesive film to bond the materials. As long as the use temperature of the hot melt adhesive film is lower than the softening temperature of the material itself, it can ensure that the material to be adhered will not be deformed during the hot pressing process. When material developers are selecting hot melt adhesive films, they need to consider this issue in advance and narrow down the range of hot melt adhesive film models to achieve a multiplier effect with less effort.